Total CVEs

126,161

Critical Severity

2,292

High Severity

7,941

Last 7 Days

1,206
Quick preset (or use dates below)
Clear Filters
Showing 21 - 40 of 43 CVEs
CVE-2025-47386 HIGH - 7.8

Memory Corruption while invoking IOCTL calls when concurrent access to shared buffer occurs.

Vendor: Qualcomm, Inc.
Product: Snapdragon
Published: Mar 02, 2026
Source: NVD
CVE-2025-47385 HIGH - 7.8

Memory Corruption when accessing trusted execution environment without proper privilege check.

Vendor: Qualcomm, Inc.
Product: Snapdragon
Published: Mar 02, 2026
Source: NVD
CVE-2025-47384 MEDIUM - 6.5

Transient DOS when MAC configures config id greater than supported maximum value.

Vendor: Qualcomm, Inc.
Product: Snapdragon
Published: Mar 02, 2026
Source: NVD
CVE-2025-47383 HIGH - 7.2

Weak configuration may lead to cryptographic issue when a VoWiFi call is triggered from UE.

Vendor: Qualcomm, Inc.
Product: Snapdragon
Published: Mar 02, 2026
Source: NVD
CVE-2025-47381 HIGH - 7.8

Memory Corruption while processing IOCTL calls when concurrent access to shared buffer occurs.

Vendor: Qualcomm, Inc.
Product: Snapdragon
Published: Mar 02, 2026
Source: NVD
CVE-2025-47379 HIGH - 7.8

Memory Corruption when concurrent access to shared buffer occurs due to improper synchronization between assignment and deallocation of buffer resources.

Vendor: Qualcomm, Inc.
Product: Snapdragon
Published: Mar 02, 2026
Source: NVD
CVE-2025-47378 HIGH - 7.1

Cryptographic Issue when a shared VM reference allows HLOS to boot loader and access cert chain.

Vendor: Qualcomm, Inc.
Product: Snapdragon
Published: Mar 02, 2026
Source: NVD
CVE-2025-47377 HIGH - 7.8

Memory Corruption when accessing a buffer after it has been freed while processing IOCTL calls.

Vendor: Qualcomm, Inc.
Product: Snapdragon
Published: Mar 02, 2026
Source: NVD
CVE-2025-47376 HIGH - 7.8

Memory Corruption when concurrent access to shared buffer occurs during IOCTL calls.

Vendor: Qualcomm, Inc.
Product: Snapdragon
Published: Mar 02, 2026
Source: NVD
CVE-2025-47375 HIGH - 7.8

Memory corruption while handling different IOCTL calls from the user-space simultaneously.

Vendor: Qualcomm, Inc.
Product: Snapdragon
Published: Mar 02, 2026
Source: NVD
CVE-2025-47373 HIGH - 7.8

Memory Corruption when accessing buffers with invalid length during TA invocation.

Vendor: Qualcomm, Inc.
Product: Snapdragon
Published: Mar 02, 2026
Source: NVD
CVE-2025-47371 MEDIUM - 6.5

Transient DOS when an LTE RLC packet with invalid TB is received by UE.

Vendor: Qualcomm, Inc.
Product: Snapdragon
Published: Mar 02, 2026
Source: NVD
CVE-2025-47402 MEDIUM - 6.5

Transient DOS when processing a received frame with an excessively large authentication information element.

Vendor: Qualcomm, Inc.
Product: Snapdragon
Published: Feb 02, 2026
Source: NVD
CVE-2025-47399 HIGH - 7.8

Memory Corruption while processing IOCTL call to update sensor property settings with invalid input parameters.

Vendor: Qualcomm, Inc.
Product: Snapdragon
Published: Feb 02, 2026
Source: NVD
CVE-2025-47398 HIGH - 7.8

Memory Corruption while deallocating graphics processing unit memory buffers due to improper handling of memory pointers.

Vendor: Qualcomm, Inc.
Product: Snapdragon
Published: Feb 02, 2026
Source: NVD
CVE-2025-47397 HIGH - 7.8

Memory Corruption when initiating GPU memory mapping using scatter-gather lists due to unchecked IOMMU mapping errors.

Vendor: Qualcomm, Inc.
Product: Snapdragon
Published: Feb 02, 2026
Source: NVD
CVE-2025-47366 HIGH - 7.1

Cryptographic issue when a Trusted Zone with outdated code is triggered by a HLOS providing incorrect input.

Vendor: Qualcomm, Inc.
Product: Snapdragon
Published: Feb 02, 2026
Source: NVD
CVE-2025-47364 MEDIUM - 6.8

Memory corruption while calculating offset from partition start point.

Vendor: Qualcomm, Inc.
Product: Snapdragon
Published: Feb 02, 2026
Source: NVD
CVE-2025-47363 MEDIUM - 6.8

Memory corruption when calculating oversized partition sizes without proper checks.

Vendor: Qualcomm, Inc.
Product: Snapdragon
Published: Feb 02, 2026
Source: NVD
CVE-2025-47359 HIGH - 7.8

Memory Corruption when multiple threads simultaneously access a memory free API.

Vendor: Qualcomm, Inc.
Product: Snapdragon
Published: Feb 02, 2026
Source: NVD